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Thermal Properties of Nano- and Microstructures


Fon, Warren Chung Wah (2004) Thermal Properties of Nano- and Microstructures. Dissertation (Ph.D.), California Institute of Technology. doi:10.7907/FK4H-CV52.


My work is on the experimental study of thermal conduction in nano and microscale structures. The work is divided into two parts. In the first part, we measure the thermal conductance of a suspended device from 4 to 40 K. The thermal conduction of a suspended, free-standing beam is analyzed to study the effect of phonon scattering on thermal conduction. We conclude that phonon scattering is much more severe in a nanoscale beam than bulk material.

In the second part of the work, we proceed to dynamic measurement to measure the heat capacity of a suspended device. From that we study the origin of heat capacity of a silicon nitride membrane. We conclude that much of the heat capacity comes from the motional tunneling states of the ions. We use the device to demonstrate an ultrasensitive calorimeter with a very high resolution of 0.5 aJ/K. We conclude the work by applying the calorimeter to study the heat capacity of a thin adsorbed film of helium gas.

Item Type:Thesis (Dissertation (Ph.D.))
Subject Keywords:nanostructure; phonon scattering; thermal
Degree Grantor:California Institute of Technology
Division:Engineering and Applied Science
Major Option:Applied Physics
Thesis Availability:Public (worldwide access)
Research Advisor(s):
  • Roukes, Michael Lee
Thesis Committee:
  • Cross, Michael Clifford (chair)
  • Bockrath, Marc William
  • Roukes, Michael Lee
  • Phillips, Robert B.
Defense Date:24 May 2004
Record Number:CaltechETD:etd-05262004-123035
Persistent URL:
Fon, Warren Chung Wah0000-0002-5447-2324
Default Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:2080
Deposited By: Imported from ETD-db
Deposited On:26 May 2004
Last Modified:03 Feb 2021 20:22

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